Summary:
- SK Hynix, a major memory chip manufacturer, has unveiled its latest memory technologies: 12-layer HBM4, HBM3E, and SOCAMM.
- HBM4 is the next-generation high-bandwidth memory standard, offering up to 819 GB/s of bandwidth, a significant improvement over previous HBM versions.
- SOCAMM is a new memory solution that combines DRAM and NAND flash, providing high capacity and performance for applications such as data centers and high-performance computing.