Emerging AI applications, like chatbots that generate natural human language, demand denser, more powerful computer chips. Faster growth and better uniformityOne problem with this process is that silicon circuits typically have aluminum or copper as a top layer so the chip can be connected to a package or carrier before it is mounted onto a printed circuit board. “The new capability of low thermal budget growth on an 8-inch scale enables the back-end-of-line integration of this material with silicon CMOS technology and paves the way for its future electronics application